This drying equipment is suitable for drying electronic components, touch screen, camera module after dispensing, curing inks after printing, and baking of IC, ICBT and other semiconductor devices after packaging.
Features- Fast temperature rise and stable temperature control;
- Small temperature fluctuation at a single point;
- High thermal insulation, external housing temperature ≤ room temperature +5℃;
- The temperature compensation is fast;
- Saving energy of 20~25% when compared with the traditional oven;
- Power consumption under constant temperature control ≤ 2℃;
| Model | |
| Internal dimension (W×D×H )(mm) | 700mm×600mm×560mm*2 Chamber |
| External dimension (W×D×H)(mm) | 1600mm×1350mm×1880mm |
| Power | AC380V 3Ø 50HZ 18kW |
| Temperature range | RT~400℃ |
| Temperature uniformity | ±1.5%℃ |
| Temperature controller | 1.Adopting the 7-inch full touch operation screen, TFT liquid crystal display,1024*600dpi, sensor universal input,100ms sampling period, imported PID module, 0.1% temperature control accuracy 2.Paperless recording function, can record 1200 days of data and export temperature curve directly 3.Internet remote monitoring function 4.Digital setting, temperature limit, constant temperature timer alarm, overheat alarm, etc. 5.0-9999min timer range |
| Materials and standards | 1.The inner chamber adopts the SUS304# mirror stainless steel sheet with concave iron reinforcement. And the outer housing adopts the SUS41# cold-rolled sheet, baking after anti-static 2.Adopting the high-quality thermal insulation cotton, the thickness of the insulation layer is 150mm 3.Adopting high temperature resistance silicon sealing strip 4.Adopting electromagnetic door lock 5.Accessories are made of the high temperature resistant and dust-proof materials, keeping workshop clean |
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